A large store of knowledge to draw on, coupled with enthusiasm and creativity, as well as the support provided by an outstanding team of experts – Karl Weidner traces his success as an inventor to all these factors. He has been working with innovative construction and connection technologies since 1980. This area includes wire bonding technology, which creates conductive connections between various contact points on a chip using small wire bridges. Now, Weidner has developed SiPLIT (Siemens Planar Interconnect Technology), a new connecting technology that can replace conventional wire bonding in electronic systems, particularly in power electronics. “The idea behind the invention is that a planar technology is being applied in the same space – and because it is planar, it allows the wires associated with the established technology to disappear,” Weidner says.